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Congratulations to our Packaging Lead, Dr. Ji Lin, and her team, Yong Chyn Ng, for receiving the 26th Electronics Packaging Technology Conference (EPTC) ‘Best Academic Paper’ Award for their work on "Critical Packaging Parameters Impacting Wafer Warpage Using FEA and Statistical Analysis Techniques." Their innovative approach combines simulations and statistical analysis to enhance wafer design processes by predicting and mitigating warpage issues early on.

Congratulations to our Packaging scientists, Dr. Tengiz Svimonishvili and Dr. Mihai Dragos Rotaru, for also winning the ‘Best Interactive Paper’ Award for their paper titled "EM and System-Level Modelling of Phased Antenna Arrays for D-Band Antenna-in-Package and Antenna-on-Package Implementation at 150 GHz." Their study advances high-frequency antenna integration for performance optimization.