Desktop X-ray Diffraction
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Residual stress and FWHM measurements on polycrystalline materials (most metallic alloys) in accordance to BS EN15305:2008.
- Non destructive for measurement at surface
- Depth profiling through layer removal
- Estimation of cold work
EQUIPMENT SPECIFICATIONS
- Model: Stresstech Xstress 3000 G3R Stress Analyzer
- Max sample dimension: 300 mm in length and width (approx.)
CAPABILITIES / APPLICATIONS
X-ray diffraction (XRD) is a common technique for residual stress measurement and well accepted in the industries. ARTC is an IEC/ISO17025:2005 accredited site for residual stress measurements using XRD.
LOCATION
ARTC Metrology Lab
3 CleanTech Loop, CleanTech Two, #01/01, òòò½Íø637143
EQUIPMENT ENQUIRY
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