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Utilizing Advanced Imaging and Image Processing for Non-Destructive Inspection in Quality Control, Failure Analysis, and New Material / Product Development

(MASTERCLASS IN EMERGING MANUFACTURING TECHNOLOGIES)

Utilizing Advanced Imaging and Image Processing for Non-Destructive Inspection in Quality Control, Failure Analysis, and New Material_Product Development

Introduction

Advanced non-destructive inspection such as online optical imaging, high-resolution X-ray computed tomography (XCT), ultrasonic testing array, lidar, and bioimaging have become essential inspection tools in many industries including electronics, life science, automotive, advanced materials, aerospace, and MedTech to address the increasing demand for product quality, cost reduction and shortening the new product development time.

This masterclass is specifically designed based on A*STAR SIMTech and ARTC researchers’ deep understanding of the trends and recent advancements of these imaging and image-processing technologies and our success stories of long-time collaboration with local industries to give participants the must-have insights, knowledge, and hands-on experience to various technologies and their typical applications so that they can choose the most suitable solutions when a particular inspection problem occurs in their workspace.

The 3-day course is carefully structured into 6 sessions.

  • Session 1 will give an overview of the various advanced imaging technologies, and then focus on optical imaging technologies and their applications.
  • Session 2 will talk about ultrasonic testing (UT), lidar, and bioimaging. Application-related issues with the technologies will be elaborated through case studies covering the use of UT for Y-shape and T-shape pipe defects inspection, lidar for container damage inspection etc.
  • Session 3 will focus on high-resolution X-ray 2D/CT imaging and its powerful functions for the metrology of internal features, defects detection, porosity analysis, fiber tensors analysis, foam material analysis, etc.
  • Session 4 and Session 5 will cover both traditional image processing and AI-assisted feature classification and discuss their respective suitable application scenarios and limitations.
  • To enhance and deepen the understanding of participants, the final session (Session 6) will arrange discussion and sharing for workspace inspection problems, followed by lab hands-on training.

Why This MasterClass

  • Learn about the latest advancements of inspection technologies such as automated vision system, high-resolution X-ray 2D/CT, phase array UT, lidar imaging, and bioimaging etc
  • Choosing the right inspection technology for your specific application needs
  • Choosing the right image-processing tools to your application
  • Understand the advantages and limitations of AI for your application needs
  • Operating principles of modern XCT and deep learning technologies
  • Learning from case studies of applying advanced vision and X-ray CT for industrial applications

Who Should Attend

  • CEOs and CTOs, technical leaders, engineering managers, engineering supervisors, product managers
  • R&D engineers, QC and failure analysis engineers, application engineers, sales engineers, new hires from any manufacturing industry sectors

PROGRAMME AGENDA

PROGRAMME AGENDA

Day 1

(Morning session)

  • OVERVIEW OF NON-DESTRUCTIVE INSPECTION TECHNOLOGIES - By Dr Andy Malcolm and Dr Liu Tong, A*STAR SIMTech
    • Optical imaging, X-ray, UT, and Lidar
  • OPTICAL IMAGING
    • Overview of imaging technologies
    • Optical imaging
    • Optical stereovision
    • Lighting and lens design for optical imaging

(Afternoon session)

  • UT AND BIOIMAGING TECHNOLOGIES - By Dr Luo Hong and Dr Tan Piau Siong, A*STAR SIMTech
    • Phase Array Ultrasonic
    • Lidar imaging
    • Bioimaging

Day 2

(Morning session)

  • ADVANCE X-RAY IMAGING - By Professor Edward Morton, CTmetrix
    • State-of-the-Art 2D and 3D X-ray Imaging (radiography and computed tomography)
    • Hardware and Software Considerations
    • Commercial and Bespoke Systems for Industry Applications
  • HIGH-RESOLUTION X-RAY CT APPLICATIONS - By Dr Liu Tong, A*STAR SIMTech
    • High-resolution metrology of both internal and external dimensions with Xray CT
    • Design and fabrication description evaluation
    • Close-to-reality FE modelling with volume meshing of CT data
    • Fibre orientation analysis for advanced fibre composites

(Afternoon session)

  • ADVANCED IMAGE-PROCESSING TECHNOLOGY - By Dr Yin Xiaoming and Mr Jiang Ting Ying, A*STAR SIMTech
    • Robust and performance-proven Image-processing technology for complex surface defects detection and wire-tracing
    • Practical and high-efficiency image-processing for porosity analysis with 2D Ultrasonic/X-ray images
    • Data processing and interpretation for non-visual data (UT and LIDAR)

Day 3

(Morning session)

  • AI IMAGE PROCESSING AND CLASSIFICATION - By Mr Dong Chaoyu, A*STAR SIMTech and Dr Wang Zhenbiao, A*STAR ARTC
    • Typical applications of artificial intelligence in machine vision
    • Image processing and feature classification using neural networks
    • Machine learning/deep learning

(Afternoon session)

  • CASE STUDIES, BRAINSTORMING, AND HANDS-ON TRAINING - By A*STAR SIMTech and ARTC Teams
    • Success stories sharing and discussion
    • Brainstorming for potential problems faced by participants
    • Visiting SIMTech X-ray Facilities at CleanTech Two venue
    • Participate in ARTC Intelligent Product Verification Workshops at CleanTech Two venue

Trainers' profile

Dr Edward James Morton

Dr Edward James Morton is an internationally recognised physicist and entrepreneur with expertise in X-ray imaging. Former CTO of Rapiscan Systems, a global leader in security imaging, he has a 15-year academic career at top universities, specialising in oncology imaging, high-resolution tomography, semiconductor detectors, and Monte Carlo physics modelling. Dr. Morton pioneered the development of Rapiscan's explosive detection and cargo systems, leading a global Science and Technology team with an $11M budget. With nearly 100 publications and over 600 patents, he is now Director of CTmetrix Pte Ltd and Adjunct Professor at the National University of Singapore.

Dr Liu Tong

Dr Liu Tong is the Section Manager for X-ray and Image Processing and Principal Research Engineer with A*STAR SIMTech. He has more than 19 years of experience in researching and using X-ray 2D/CT imaging for industrial applications. Over the years, he has successfully commercialized several patented technologies, like X-ray CT reconstruction for planar objects, automated CT central-ray determination, compact stereovision head, and glass inclusion detection.

Dr Yin Xiaoming

Dr Yin Xiaoming received her PhD degree in Computer Vision from the Nanyang Technological University, òòò½Íøin 2002. Since 2001, she has been working at A*STAR SIMTech as a Lead Research Engineer, focusing on algorithm and software development for 2D/3D image processing, x-ray image processing, object detection, defect inspection etc.

Upon Completion of This MasterClass

Upon Completion

Participants will be awarded with a Certificate of Attendance (COA) by SIMTech and/or ARTC if they achieve at least 75% course attendance.

Full and Nett Course Fees

Full Course Fee

The full course fee for this course is $2,800 before funding and prevailing GST.

Nett Course Fee

International
Participants
òòò½ÍøCitizens aged 39 years and below, òòò½ÍøPermanent Residents and LTVP+ Holders
Employer-sponsored and self-sponsored òòò½ÍøCitizens aged 40 years and older (MCES) ²SME-sponsored local employees (i.e òòò½ÍøCitizens, òòò½ÍøPermanent Residents and LTVP+ Holders) (ETSS) ¹
$3,052$915.60$355.60
$355.60
All fees are inclusive of GST 9%.


Remarks

  • Participants may not be eligible for subsidies if they have already attended a MasterClass under the same title.
 
Please note that fees and funding amount are subject to change.

LONG TERM VISIT PASS PLUS (LTVP+) HOLDERS

  • The LTVP+ scheme applies to lawful foreign spouses of òòò½ÍøCitizens with (i) at least one òòò½ÍøCitizen child or are expecting one from the marriage, or at least three years of marriage, and (ii) where the òòò½ÍøCitizen sponsor is able to support the family.
  •  All LTVP+ holders can be identified with their green visit pass cards, with the word ‘PLUS’ printed on the back of the card.

ENHANCED TRAINING SUPPORT FOR SMALL & MEDIUM ENTERPRISE (SMEs) SCHEME (ETSS)

  • The ¹ is for company-sponsored participants who are subject to the eligibility criteria shown below:

SMEs that meet all of the following eligibility criteria:

  • Registered or incorporated in Singapore
  • Employment size of not more than 200 or with annual sales turnover of not more than $100 million

SME-sponsored Trainees:

  • Must be òòò½ÍøCitizens or òòò½ÍøPermanent Residents.
  • Courses have to be fully paid for by the employer.
  • Trainee is not a full-time national serviceman. 

Further Info: This scheme is intended for all organisations, including non-business entities not registered with ACRA e.g. VWOs, societies, etc. Only ministries, statutory boards, and other government agencies are NOT eligible under Enhanced Training Support for SMEs Scheme. Sole proprietorships which meet all of the above criteria are also eligible.

SKILLSFUTURE MID-CAREER ENHANCED SUBSIDY (MCES)

  • The ² is meant for employer-sponsored and self-sponsored òòò½ÍøCitizens aged 40 years old and above.

SkillsFuture Credit

  • All Singaporeans aged 25 years old and above are eligible for  which can be used to offset course fees (for self-sponsored registrations only).
For more information on the SkillsFuture funding schemes you are eligible for, please visit

How course fees are calculated

 TYPECATEGORY OF INDIVIDUALS 
International Participants òòò½ÍøCitizens aged 39 years and below, òòò½ÍøPermanent Residents and LTVP+ HoldersEmployer-sponsored and self-sponsored òòò½ÍøCitizens aged 40 years and aboveSME-sponsored local employees (i.e òòò½ÍøCitizens, òòò½ÍøPermanent Residents and LTVP+ Holders) 
FUNDING SOURCE
Not applicable for SkillsFuture Funding  SkillsFuture Funding (Baseline) SkillsFuture Mid-career Enhanced Subsidy (MCES) ²SkillsFuture Enhanced Training Support for SMEs (ETSS) ¹
 Full Course Fee $2,800 $2,800$2,800  $2,800
SkillsFuture FundingNot Applicable  ($1,960) ($2,520) ($2,520)
Nett Course Fee $2,800 $840$280$280
GST 9%
$252 $75.60* $75.60*  $75.60*
Total Nett Course Fee Payable to Training Provider$3,502$915.60 $355.60$355.60
* Based on 30% of Full Course Fee

Contact Us

  • For technical enquiries, please contact:

Dr LIU Tong,
Email:  tliu@SIMTech.a-star.edu.sg

  • For general enquiries, please contact:

Ms Charlotte LIM,
Email: charlotte_lim@SIMTech.a-star.edu.sg


Registration

  • Please register for this course through our Course Registration Form for Public Classes.
  • For the first question, please select "MasterClasses".
  • Applicants will be placed on our waiting list if the course does not have an upcoming scheduled intake.
  • Once the next intake is confirmed to commence, SIMTech will contact the applicants to share the class information.

Collaterals


Schedule

Module
Skills Course Reference NumberNext Intake(s)'s Training Period
(Click on the dates to view its schedules)
Registration Status
  • Utilizing Advanced Imaging and Image Processing for Non-Destructive Inspection in Quality Control, Failure Analysis, and New Material / Product Development

    (MasterClass in Emerging Manufacturing Technologies)
TGS-2024045280The next intake's schedule is still in the planning stage.  

Note: SIMTech and ARTC reserve the right to change the class/schedule/course fee or any details about the course without prior notice to the participants.

Announcement:

  • From 1 Oct 2023, attendance-taking for SkillsFuture òòò½Íø(SSG)'s funded courses must be done digitally via the Singpass App. More information may be viewed here.
Sessions
FD: Full day
AM: Morning
PM: Afternoon
EVE: Evening